The Sunshine LS2 Mini is a professional tool, designed for repairing mobile phone motherboards,
including Android models with special shapes. It is ideal for separating layers, soldering, tinning, and adhesive removal,
providing precise temperature control and uniform heating for efficient service operations.
Constructed from aluminum alloy, the hotplate has high thermal conductivity, allowing for rapid and uniform heating,
without the risk of deformation. The compact and metallic design combines functionality with modern aesthetics, making it easy to transport and use in any workspace.
The intelligent temperature control system allows temperature adjustment between 0 and 260 degrees C, offering flexibility according to the needs of each repair process.
The 3-in-1 digital display clearly shows the set temperature and the actual temperature, ensuring high precision and optimal heat control.
With the Sunshine LS2 Mini, technicians benefit from a compact, yet powerful,
equipment capable of optimizing workflow and facilitating complex motherboard repairs.
Features:
- Extended compatibility: suitable for Android motherboards and other special models, used for layer separation, soldering, tinning, and adhesive removal
- Rapid and uniform heating: made from aluminum alloy with high thermal conductivity, ensures efficient heating without deformation
- Compact and metallic design: small dimensions for portability and practicality, with a modern and professional look
- Intelligent temperature control: adjustment from 0-260 degrees C, allowing precise adaptation to different repair operations
- 3-in-1 digital display: shows the set temperature and the actual temperature for increased precision and safety
- Durable and resistant materials: robust construction, ideal for prolonged use in mobile phone service centers