The Relife TK5 BGA tool is designed for professional repair work on motherboards, ICs, and processors, offering precision and control in delicate operations
such as adhesive removal, component detachment, and fine prying tasks. Due to its versatility, it is an indispensable tool
in electronics and mobile repair services. The blades are made from high-hardness material, featuring excellent elasticity and resistance to deformation,
even after repeated use. High-precision laser cutting ensures clean, burr-free edges for safe and efficient interventions.
Features:
- Usage: IC, CPU, BGA repairs, adhesive removal, precision prying
- 7 types of blades for various applications
- Durable, elastic, hard-to-deform blades
- High-precision laser cutting, burr-free
- Handle with non-slip, comfortable design
- Handle size: approx. 11.7 x 0.8 cm
Package contents:
- BGA tool
- Blades